光電子部品の製造方法、及び製造装置

Title:

光電子部品の製造方法、及び製造装置

Document Type and Number:

Japanese Patent JP5827604

Kind Code:

B2

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Inventors:

Hirokazu Okada
Miyagawa Shigeru
Gamo Kiyoshige
Makoto Matsuo
Kazuhiro Takahashi
Kuni Onishi

Application Number:

JP2012173612A

Publication Date:

December 02, 2015

Filing Date:

August 06, 2012

Export Citation:

Assignee:

towa corporation

International Classes:

H01L33/52; B29C43/18

Domestic Patent References:

Attorney, Agent or Firm:

Kyoto International Patent Office

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