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Patent Searching and Data


Title:
カプセル封入ユニットを有する装置
Document Type and Number:
Japanese Patent JP5832093
Kind Code:
B2
Abstract:
A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate (1) with at least one functional layer (22), and an electronic component, applying at least one first barrier layer (3) on the functional layer (22) by way of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer (4) on the functional layer (22) by way of plasma-enhanced chemical v0apor deposition (PECVD).

Inventors:
Christian schmidt
Tillman Schlenker
Heli belt tool
Ralph Petzold
Marx Klein
Karsten Heuser
Application Number:
JP2010544582A
Publication Date:
December 16, 2015
Filing Date:
January 29, 2009
Export Citation:
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Assignee:
OSRAM OLED GmbH
International Classes:
B32B9/00; G09F9/30; H01L27/32; H01L51/50; H05B33/04
Domestic Patent References:
JP2001284042A
JP2005524946A
JP2005119148A
JP200058777A
JP200422281A
Foreign References:
WO2006134812A1
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Takuya Kuno
Kimihiro Hoshi