Title:
ヒートシール可能な複合ポリエステルフィルム
Document Type and Number:
Japanese Patent JP5833534
Kind Code:
B2
Abstract:
A heat-sealable, coextruded composite polymeric film comprising a substrate layer comprising a first copolyester material having on a surface thereof a heat-sealable layer comprising a second copolyester material wherein: (i) the first and second copolyester materials are different from each other; (ii) the copolyester of the substrate layer comprises an aromatic dicarboxylic acid and a saturated aliphatic dicarboxylic acid of formula CnH2n(COOH)2 wherein n is 2 to 8; (iii) the heat-sealable layer comprises one or more wax(es); and (iv) the composite film is shrinkable or thermoformable; and the use thereof as a packaging film, particularly as, or in the manufacture of, a lidding film for heat-sealing to a receptacle containing a food product.
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Inventors:
Berry michael earl
Brennan William Jay
Den Feng Hua
Thunders daniel sea
Brennan William Jay
Den Feng Hua
Thunders daniel sea
Application Number:
JP2012270627A
Publication Date:
December 16, 2015
Filing Date:
December 11, 2012
Export Citation:
Assignee:
DuPont Teijin Films US Limited Partnership
International Classes:
B32B27/36; B65D65/40; B65D77/20
Domestic Patent References:
| JP2005515100A | ||||
| JP2005145068A |
Foreign References:
| EP0712719A1 | ||||
| WO2006075151A1 |
Attorney, Agent or Firm:
Sadao Kumakura
Atsushi Hakoda
Kenji Asai
Kazuo Yamazaki
Atsushi Hakoda
Kenji Asai
Kazuo Yamazaki
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