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Title:
レジストパターン形成方法、感放射線性樹脂組成物及びレジスト膜
Document Type and Number:
Japanese Patent JP5835319
Kind Code:
B2
Abstract:
A resist pattern-forming method includes providing a resist film having a surface free energy of 30 to 40 mN/m on a substrate using a radiation-sensitive resin composition. The resist film is exposed by applying radiation via a mask. The exposed resist film is developed. It is preferable that the exposing of the resist film includes exposing the resist film via an immersion liquid that is provided over the resist film.

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Inventors:
Hiromitsu Nakajima
Toru Kimura
Yusuke Asano
Masashi Hori
Kimura Reiko
Kazuki Kazuki
Miyata
Masashi Yoshida
Application Number:
JP2013507703A
Publication Date:
December 24, 2015
Filing Date:
March 28, 2012
Export Citation:
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Assignee:
JSR CORPORATION
International Classes:
G03F7/039; C08F220/22; G03F7/004; G03F7/38
Domestic Patent References:
JP2010061116A2010-03-18
JP2010277043A2010-12-09
JP2007297590A2007-11-15
Attorney, Agent or Firm:
Hajime Amano



 
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