Title:
金属めっきされたＴｉ材の製造方法および多孔質電極の製造方法
Document Type and Number:
Japanese Patent JP5836985
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent the mixing of another treating solution into a plating solution, which causes a change in the properties of the plating solution and reduction in the strength of a plated film, and to enhance the adhesion strength of the plated film in a metal-plated Ti-material.SOLUTION: A method for producing a metal-plated Ti material includes: a first step for performing degreasing by immersing a base Ti material into a degreasing solution; a second step for cleaning the Ti material passed through the first step with water; a third step for immersing the Ti material passed through the second step into an acidic aqueous solution; a fourth step for cleaning the Ti material passed through the third step with water, a fifth step for immersing the Ti material passed through the fourth step into an etching solution; a sixth step for cleaning the Ti material passed through the fifth step with water; a seventh step for immersing the Ti material passed through the sixth step into an acidic aqueous solution; an eighth step for cleaning the Ti material passed through the seventh step with water; and a ninth step for immersing the Ti material passed through the eighth step into an aqueous solution containing a metal salt and performing electroplating.
Inventors:
Ryuta Kawashita
Akio Masuda
Akio Masuda
Application Number:
JP2013030577A
Publication Date:
December 24, 2015
Filing Date:
February 20, 2013
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
C25D5/38; C25B11/03; C25B11/10; C25D5/28
Domestic Patent References:
| JP8176852A | ||||
| JP8218185A | ||||
| JP7090595A | ||||
| JP58147561A | ||||
| JP58042790A | ||||
| JP2008050675A | ||||
| JP49107931A | ||||
| JP2009114522A | ||||
| JP2013216940A |
Attorney, Agent or Firm:
Masuo Oiwa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa
Takenaka Ikuo
Keigo Murakami
Kenji Yoshizawa