Title:
モジュール式経皮弁構造体及び送達方法
Document Type and Number:
Japanese Patent JP5837422
Kind Code:
B2
Abstract:
To provide a modular percutaneous prosthetic valve device for implantation in a patient.SOLUTION: The valve device is designed as two or more modules to be delivered unassembled and combined into an assembled valve device in the body, e.g., in the body at or near the site where implantation occurs. The two or more modules may be a support structure and a valve assembly. The valve assembly may be formed from two or more valve sections. Because the valve device of the invention is deliverable as modules, it may have a smaller delivery diameter than pre-assembled percutaneous valves and permits use of a delivery device of reduced diameter. Delivering the valve device as modules increases the flexibility of the valve device during delivery, compared to percutaneous valve devices in the art.SELECTED DRAWING: Figure 1
Inventors:
Victor Yoram
Victor Jacob
Victor Jacob
Application Number:
JP2011544944A
Publication Date:
December 24, 2015
Filing Date:
January 13, 2010
Export Citation:
Assignee:
VALVE MEDICAL LTD
International Classes:
A61F2/24; A61M29/00; A61M29/02
Domestic Patent References:
| JP2009535128A | ||||
| JP2007525291A | ||||
| JP2007516055A |
Foreign References:
| US20080183273 | ||||
| WO2009042196A2 |
Attorney, Agent or Firm:
Akihiro Yamamura
Masaki Hirota
Masaki Hirota