Title:
硬化性組成物、及びその硬化物
Document Type and Number:
Japanese Patent JP5840611
Kind Code:
B2
Abstract:
Disclosed is a curable composition that exhibits a low viscosity before curing, rapidly cures upon heating, and can form a cured resin that has a low Abbe number of 30 or less, is highly transparent and heat-resistant, and is resistant to yellowing even under high-temperature conditions, such as reflow soldering. Also disclosed are: the cured resin obtained by curing the aforementioned curable composition; and an optical member comprising said cured resin. The disclosed curable resin composition is characterized by containing the belowmentioned components (A and B) in a weight ratio (A:B) between 70:30 and 99:1 and also containing a thiol compound. Component A is a compound that contains a fluorene ring and two (meth)acryloyloxy groups per molecule, and component B is a compound that does not contain a fluorene ring and contains at least one vinyl group or (meth)acryloyloxy group per molecule.
Inventors:
Takashi Kubo
Takeshi Fujikawa
Takeshi Fujikawa
Application Number:
JP2012528642A
Publication Date:
January 06, 2016
Filing Date:
August 01, 2011
Export Citation:
Assignee:
Daicel Corporation
International Classes:
C08L33/04; C08F220/20; C08K5/37
Domestic Patent References:
| JPH072939A | 1995-01-06 | |||
| JP2005187661A | 2005-07-14 | |||
| JPH04325508A | 1992-11-13 | |||
| JP2010037470A | 2010-02-18 | |||
| JP2002097224A | 2002-04-02 | |||
| JP2010254732A | 2010-11-11 | |||
| JP2010248358A | 2010-11-04 | |||
| JP2011126991A | 2011-06-30 |
Attorney, Agent or Firm:
Yukihisa Goto