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Title:
金属粉ペースト、及びその製造方法
Document Type and Number:
Japanese Patent JP5843821
Kind Code:
B2
Abstract:
A method for producing a surface-treated metal powder, which comprises: a step for preparing a metal powder dispersion liquid by mixing a metal powder with an aqueous solution of a coupling agent having an amino group; a step for recovering, as a residue, the metal powder from the metal powder dispersion liquid; and a step for cleaning the metal powder, which has been recovered as a residue, with use of an aqueous solvent. This method for producing a surface-treated metal powder provides a method for producing a surface-treated copper powder or metal powder which has excellent sintering delaying properties and is suitable for use in the production of an electrode for multilayer ceramic chip capacitors.

Inventors:
Hideki Furusawa
Application Number:
JP2013168386A
Publication Date:
January 13, 2016
Filing Date:
August 13, 2013
Export Citation:
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Assignee:
jx Nippon Mining & Metals Co., Ltd.
International Classes:
B22F1/10; B22F1/102; B22F1/145; B22F9/00; H01B1/00; H01B1/22; H01B13/00; H01G4/12; H01G4/232; H01G4/30; B22F1/103
Domestic Patent References:
JP2007197752A
JP2006097123A
JP2007126750A
JP4190502A
JP4214770A
Attorney, Agent or Firm:
Axis International Patent Business Corporation