Title:
基板処理方法、プログラム及びコンピュータ記憶媒体
Document Type and Number:
Japanese Patent JP5847738
Kind Code:
B2
Abstract:
This substrate processing method comprises: a coating film formation step wherein a coating film that is soluble in an alkali solution is formed on a substrate; a resist pattern formation step wherein a resist pattern is formed on the coating film; a pattern processing step wherein a predetermined pattern is formed on the substrate using the resist pattern as a mask; a coating film removal step wherein the resist pattern is removed by removing the coating film with use of an alkali solution after the pattern processing step; a block copolymer application step wherein a block copolymer is applied over the substrate after the coating film and the resist pattern are removed therefrom; and a polymer separation step wherein the block copolymer is subjected to phase separation into a first polymer and a second polymer.
Inventors:
Makoto Muramatsu
Takahiro Kitano
Tadatoshi Tomita
Kei Tauchi
Soichiro Okada
Takahiro Kitano
Tadatoshi Tomita
Kei Tauchi
Soichiro Okada
Application Number:
JP2013015301A
Publication Date:
January 27, 2016
Filing Date:
January 30, 2013
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027
Domestic Patent References:
| JP2008036491A | ||||
| JP62136028A | ||||
| JP2012061531A |
Foreign References:
| WO2012014700A1 | ||||
| WO2012046770A1 |
Attorney, Agent or Firm:
Tetsuo Kanamoto
Miaki Kametani
Koji Hagiwara
Naoki Ogita
Miaki Kametani
Koji Hagiwara
Naoki Ogita