Title:
無菌接合装置
Document Type and Number:
Japanese Patent JP5851258
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an aseptic joining device capable of certainly fusion-cutting and joining two tubes when fusion-cutting and joining the tubes.SOLUTION: This aseptic joining device includes: an interlock pin 60 as a fixing member fixing a closed clamp lid part 3 such that the clamp lid part 3 is not opened by abutting on the clamp lid part 3, and bringing the clamp lid part 3 into a state that the clamp lid part 3 can be opened by releasing the abutment on the clamp lid part 3; a wafer WF as a heating member for heating and fusion-cutting a first tube T1 and a second tube T2; a heater 110 heating the wafer WF; a temperature sensor 87 measuring the temperature of environment wherein a casing is placed; and a control part 100 changing a time for which a current is carried through the heater 110 based on the temperature of the environment measured by the temperature sensor 87, and changing a time for which the wafer WF heats the first tube T1 and the second tube T2.
Inventors:
Izumi Shun
Katsuya Matsui
Katsuya Matsui
Application Number:
JP2012013396A
Publication Date:
February 03, 2016
Filing Date:
January 25, 2012
Export Citation:
Assignee:
Terumo Corporation
International Classes:
A61M1/14; A61M1/28; A61M5/14; B29C65/74
Domestic Patent References:
| JP2000202034A | ||||
| JP2005022341A |
Attorney, Agent or Firm:
岡▲崎▼ 信太郎
Arai Zen
Arai Zen