印刷装置、印刷装置の温度調整方法、および印刷装置の温度調整システム

Title:

印刷装置、印刷装置の温度調整方法、および印刷装置の温度調整システム

Document Type and Number:

Japanese Patent JP5854857

Kind Code:

B2

Abstract:

The inside of a housing of a printer device is cooled by the air from a ventilation port and, consequently, the temperature of solder SP on a mask surface supported by a mask holding frame inside the housing can be kept low. Moreover, provided is a mask cover for blocking the air flow from the ventilation port toward the mask, and the drying of the solder SP caused by the wind from the ventilation port is thereby inhibited as a result of the wind from the ventilation port not coming into contact with the solder SP on the mask surface. In this way, the solder SP is cooled while inhibiting the drying of the solder SP and, consequently, it is possible to appropriately inhibit the change in viscosity of the solder SP, and favorable printing can be realized.

Inventors:

Usui Yusuke

Application Number:

JP2012011964A

Publication Date:

February 09, 2016

Filing Date:

January 24, 2012

Export Citation:

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