Title:
半導体ウェハ加工用粘着テープ及び半導体ウェハの分割方法
Document Type and Number:
Japanese Patent JP5855034
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive tape for processing a semiconductor wafer, with which a stealth dicing process and a gas etching process can be carried out while using a consistent tape.SOLUTION: The adhesive tape for processing a semiconductor wafer includes an adhesive layer disposed on a base film, in which the base film shows a shrinkage percentage of 0 to 1.0% when heated at 80°C for 1 hour. The adhesive tape for processing a semiconductor wafer has a tensile strength of 30 to 70 N/10 mm.
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Inventors:
Akira Akutsu
Yabuki Akira
Yabuki Akira
Application Number:
JP2013028712A
Publication Date:
February 09, 2016
Filing Date:
February 18, 2013
Export Citation:
Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
H01L21/301; C09J7/02; C09J201/00
Domestic Patent References:
| JP2006245487A | ||||
| JP2010118537A | ||||
| JP2012028598A | ||||
| JP2007220693A |
Foreign References:
| US20050031861 |
Attorney, Agent or Firm:
Seiichi Inoue