Title:
気孔直径の多峰性分布をもつ研磨パッド
Document Type and Number:
Japanese Patent JP5856622
Kind Code:
B2
Abstract:
Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described.
Inventors:
Wan, pin
Scott, Diane
La Casse, James P.
Allison, William Sea.
Scott, Diane
La Casse, James P.
Allison, William Sea.
Application Number:
JP2013533944A
Publication Date:
February 10, 2016
Filing Date:
October 11, 2011
Export Citation:
Assignee:
Nexplanar corporation
International Classes:
H01L21/304; B24B37/24; B24B37/26
Domestic Patent References:
| JP2000344902A | ||||
| JP2005532176A | ||||
| JP2008238399A |
Foreign References:
| WO2009126171A1 |
Attorney, Agent or Firm:
Hidesaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto