Title:
半導体封止用接着剤、半導体装置の製造方法及び半導体装置
Document Type and Number:
Japanese Patent JP5857462
Kind Code:
B2
Inventors:
Kazutaka Honda
Kikuchi Shogo
Kikuchi Shogo
Application Number:
JP2011134084A
Publication Date:
February 10, 2016
Filing Date:
June 16, 2011
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L23/29; H01L21/60; H01L23/31
Domestic Patent References:
| JP2001302765A | ||||
| JP2011029392A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano
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