Title:
基板保持具及び縦型熱処理装置並びに縦型熱処理装置の運転方法
Document Type and Number:
Japanese Patent JP5857776
Kind Code:
B2
Abstract:
A substrate support instrument includes a first support instrument portion and a second support instrument portion detachably combined with each other. Each of the first support instrument portion and second support instrument portion includes: a ceiling plate and a bottom plate facing each other upward and downward; a support pillar disposed in plurality along a peripheral edge portion of each of the ceiling plate and bottom plate, and configured to connect the ceiling plate and the bottom plate; and a support part disposed at a position corresponding to each of the support pillars, and configured to support a bottom of each substrate. In the support part, a height position is set such that a substrate supported in the first support instrument portion and a substrate supported in the second support instrument portion are alternately arranged, when the first support instrument portion is combined with the second support instrument portion.
Inventors:
Hiroyuki Matsuura
Katsuya Toba
Katsuya Toba
Application Number:
JP2012026464A
Publication Date:
February 10, 2016
Filing Date:
February 09, 2012
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/683; H01L21/31
Domestic Patent References:
| JP2009506573A | ||||
| JP2009081258A | ||||
| JP7235508A | ||||
| JP2005005379A |
Foreign References:
| US20090191042 |
Attorney, Agent or Firm:
Toshio Inoue