Title:
発光ダイオードモジュール
Document Type and Number:
Japanese Patent JP5859050
Kind Code:
B2
Abstract:
In a light-emitting diode module (1), a plurality of light-emitting diode elements (2) are disposed atop a copper substrate (3). A reflective plate (5) is attached to a predetermined region α on top of the copper substrate (3) so as to adhere entirely thereto. On the reflective plate (5), the light-emitting diode elements (2) are mounted in an electrically insulated state. A titanium oxide thin film (7) is formed by means of vacuum deposition onto the entire surface of the side of the reflective plate (5) onto which the plurality of light-emitting diode elements (2) are secured. Atop the copper substrate (3), the plurality of light-emitting diode elements (2) are enclosed along with the reflective plate (5) by a light transmission resin that includes a fluorescent material.
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Inventors:
Hiroki Tsuda
Application Number:
JP2014072970A
Publication Date:
February 10, 2016
Filing Date:
March 31, 2014
Export Citation:
Assignee:
Sodick Co., Ltd.
International Classes:
H01L33/64; F21K9/00; F21S2/00; H01L33/60
Domestic Patent References:
| JP2012109529A | ||||
| JP2009054897A | ||||
| JP2014033027A | ||||
| JP2011044593A | ||||
| JP2013149683A |
Foreign References:
| WO2010113852A1 | ||||
| WO2009119461A1 |