Title:
被測定物の特性の測定方法、および、それに用いられるセンシングデバイス
Document Type and Number:
Japanese Patent JP5859955
Kind Code:
B2
Abstract:
A method of measuring characteristics of a specimen, the measuring method including the steps of bonding the specimen to a host molecule on a sensing device, emitting an electromagnetic wave of a particular frequency to the sensing device to which the specimen is bonded, measuring a frequency characteristic of the transmitted or reflected light, and measuring the characteristics of the specimen based on a change of the frequency characteristic, wherein an absorbance of the host molecule per unit quantity at the particular frequency is smaller than that of the specimen.
Inventors:
Koji Tanaka
Seiji Kaminami
Takashi Kondo
Takigawa Kazuhiro
Yoshiko Miura
Seiji Kaminami
Takashi Kondo
Takigawa Kazuhiro
Yoshiko Miura
Application Number:
JP2012509327A
Publication Date:
February 16, 2016
Filing Date:
January 20, 2011
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
G01N33/48
Domestic Patent References:
| JP2006125860A | 2006-05-18 |
Foreign References:
| WO2008093647A1 | 2008-08-07 |
Other References:
JPN6014013389; 竹中繁織: '"簡易診断を目指した次世代チップの開発"' 日本化学会講演予稿集 Ｖｏｌｕｍｅ ８４， Ｎｕｍｂｅｒ １, 2004, Ｐａｇｅ Ａ-７
Attorney, Agent or Firm:
Fukami patent office
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