Title:
射出成形同時積層用フィルム及び成形品、並びにそれらの製造方法
Document Type and Number:
Japanese Patent JP5861414
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a film for lamination which has a favorable molding property, curl resistance, and damage resistance in an injection molding simultaneous laminating method having a step of holding the whole circumference including a region where a film for lamination is pre-molded between a film clamp and a mold, and performing pre-molding, and a molding using the film, and a method for manufacturing the film and the molding.SOLUTION: The film for lamination and the molding using the film and the method for manufacturing the film and the molding are provided, the film for laminating being used in the injection molding simultaneous laminating method having the step of holding the whole circumference including the region where the film for laminating is pre-molded between the film clamp and the mold, and performing pre-molding by performing vacuum suction from the mold side, the film for lamination being formed by laminating a release layer and a protective layer on a substrate in this order, the protective layer being a cured material of an ionizing radiation curable resin composition, the thickness of the substrate being from 40 to 300 μm, the thickness of the protective layer being 50 μm or less, the modulus of elongation of the substrate being higher than the modulus of elongation of the protective layer and being 3,000 MPa or lower.
More Like This:
| JP3917018 | MANIFOLD |
| JPS5772757 | METHOD AND APPARATUS FOR CONTINUOUSLY MOLDING ARTICLE |
| JP4555488 | Cleaner device and resin sealing device |
Inventors:
Akiju Noda
Haruka Mishiba
Hiroyuki Atake
Haruka Mishiba
Hiroyuki Atake
Application Number:
JP2011262261A
Publication Date:
February 16, 2016
Filing Date:
November 30, 2011
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
B29C45/14; B32B7/06; B32B27/30; B32B33/00
Domestic Patent References:
| JP2011131410A | ||||
| JP2011189579A |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kenichi Hirasawa