Title:
多層配線基板
Document Type and Number:
Japanese Patent JP5865771
Kind Code:
B2
Abstract:
To provide a multilayer wiring board that ensures sufficient close contact strength between a conformal type conductor and a resin insulating layer. A multilayer wiring board includes a multilayered construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately layered. In each of a plurality of via holes formed in the resin insulating layers, a conformal via conductor is formed to electrically connect between the conductor layers. Filling up parts of the resin insulating layers layered at upper layer side inside of the conformal via conductor forms an anchor portion. The lower end side of the anchor portion bulges larger than the upper end side in the radially outward direction of the via hole.
Inventors:
Maeda Shinosuke
Application Number:
JP2012101907A
Publication Date:
February 17, 2016
Filing Date:
April 26, 2012
Export Citation:
Assignee:
Nippon Special Ceramics Co., Ltd.
International Classes:
H05K3/46
Domestic Patent References:
| JP2001257470A | ||||
| JP2007227512A | ||||
| JP2005183548A |
Foreign References:
| WO2010076875A1 |
Attorney, Agent or Firm:
Hisahiko Atsumi