Title:
電解銅合金箔及びキャリア箔付電解銅合金箔
Document Type and Number:
Japanese Patent JP5875350
Kind Code:
B2
Abstract:
An object of the present invention is to provide an electro-deposited copper-alloy foil excellent in infrared laser processability which enables uniform etching rate along a thickness direction in following etching process. To achieve the object, an electro-deposited copper-alloy foil obtained from electrolyzing of an electrolytic solution, wherein the electro-deposited copper-alloy foil has tin content of 8% by mass to 25% by mass is employed. In the electro-deposited copper-alloy foil, a grain in a crystal structure is preferably a columnar grain longitudinal along a thickness direction.
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Inventors:
Mitsuyoshi Matsuda
Yoshikawa Kazuhiro
Nobuo Fujimoto
Yoshikawa Kazuhiro
Nobuo Fujimoto
Application Number:
JP2011263093A
Publication Date:
March 02, 2016
Filing Date:
November 30, 2011
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C25D1/04; H05K1/09
Domestic Patent References:
| JP2000017476A | ||||
| JP2003041334A |
Foreign References:
| WO1997043466A1 |
Attorney, Agent or Firm:
Katsuhiro Yoshimura