Title:
硬化性エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP5877163
Kind Code:
B2
Abstract:
To provide a curable epoxy resin composition that exhibits excellent fluidity during molding without having adverse effects on the physical properties of the cured material. A curable epoxy resin composition, containing (I) a curable epoxy resin, and (II) an epoxy functional group- and aromatic hydrocarbon group-containing organopolysiloxane having an epoxy equivalent weight of 3,000 or lower, a content of aromatic hydrocarbon groups of 45 to 80% by weight (mass), and a glass transition point of less than 0°C.
Inventors:
Toru Masatomi
Takeshi Yoshizawa
Yoshitsugu Morita
Motoi Sasaki
Takeshi Yoshizawa
Yoshitsugu Morita
Motoi Sasaki
Application Number:
JP2012550973A
Publication Date:
March 02, 2016
Filing Date:
December 27, 2011
Export Citation:
Assignee:
DOW CORNING CORPORATION
International Classes:
C08G59/20; C08K3/36; C08K7/18; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JPH06298940A | 1994-10-25 | |||
| JPH1095835A | 1998-04-14 | |||
| JPH07310017A | 1995-11-28 | |||
| JPS6420226A | 1989-01-24 | |||
| JPH06298940A | 1994-10-25 | |||
| JPH1095835A | 1998-04-14 | |||
| JPH07310017A | 1995-11-28 | |||
| JPS6420226A | 1989-01-24 |
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Yasuhiko Murayama
Tadashi Takahashi
Takashi Watanabe
Suzuki Mitsuyoshi
Yasuhiko Murayama