Title:
電解銅箔
Document Type and Number:
Japanese Patent JP5883485
Kind Code:
B2
Abstract:
An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.
Inventors:
Zhou Ruichang
Zheng Katsura Forest
Ryo Yoo
Raki
Mt. Liu
Zheng Katsura Forest
Ryo Yoo
Raki
Mt. Liu
Application Number:
JP2014173655A
Publication Date:
March 15, 2016
Filing Date:
August 28, 2014
Export Citation:
Assignee:
Changchun Petroleum Chemical Co., Ltd.
International Classes:
C25D1/04; C25D1/00
Domestic Patent References:
| JP2011174146A | ||||
| JP7268678A | ||||
| JP2012169597A | ||||
| JP2006052441A | ||||
| JP2012022939A | ||||
| JP2012038700A |
Foreign References:
| WO2014002996A1 | ||||
| WO1997043466A1 | ||||
| WO2012101984A1 |
Attorney, Agent or Firm:
Patent corporation ssinpat