Title:
銀銅合金焼結体形成用の粘土状組成物、銀銅合金焼結体形成用の粘土状組成物用粉末、銀銅合金焼結体形成用の粘土状組成物の製造方法、銀銅合金焼結体の製造方法および銀銅合金焼結体
Document Type and Number:
Japanese Patent JP5888483
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a silver-copper alloy sintered compact produced from a clay composition for forming the silver-copper alloy sintered compact capable of forming the silver-copper alloy sintered compact which is not easily discolored even in an air atmosphere and has excellent tensile strength, bending strength, surface hardness, and elongation etc., and a method for producing the silver-copper alloy sintered compact.SOLUTION: The clay composition for forming the silver-copper alloy sintered compact comprises: a powder component containing silver-containing powder and oxygen-containing powder; a binder; and water; wherein, in the oxygen-containing copper powder, pure Cu is present at the central part of each particle, while copper oxide is formed at the surface layer part of the pure Cu, and further, the ratio of the pure Cu to the whole of the oxygen-containing copper powder lies in the range of 0.7 to 80 mass%, and the total of the copper oxide is controlled to ≥20 mass% to the whole of the oxygen-containing copper powder. The clay composition for forming the silver-copper alloy sintered compact is fired to solve the problems.
Inventors:
Takashi Yamaji
Yoshifumi Yamamoto
Yasuo Ido
Shinji Otani
Yoshifumi Yamamoto
Yasuo Ido
Shinji Otani
Application Number:
JP2011186777A
Publication Date:
March 22, 2016
Filing Date:
August 30, 2011
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
B22F1/00; B22F3/10; C22C5/08; C22C9/00; C22C29/12; C22C32/00
Domestic Patent References:
JP9227904A | ||||
JP2002220604A | ||||
JP2001191696A | ||||
JP2002356702A | ||||
JP5126747A |
Attorney, Agent or Firm:
Kageyama Shuichi
Kazuo Tomita
Masayuki Miyake
Kazuo Tomita
Masayuki Miyake
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