Title:
電力用半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5892742
Kind Code:
B2
Inventors:
Masakazu Sagawa
Application Number:
JP2011164169A
Publication Date:
March 23, 2016
Filing Date:
July 27, 2011
Export Citation:
Assignee:
Hitachi Power Device Co., Ltd.
International Classes:
H01L29/739; H01L21/336; H01L27/04; H01L29/78
Domestic Patent References:
| JP2010212530A | ||||
| JP4286163A | ||||
| JP2004103763A | ||||
| JP2010087140A | ||||
| JP2007213888A |
Attorney, Agent or Firm:
Isono Dozo