Title:
半導体集積回路装置の製造方法
Document Type and Number:
Japanese Patent JP5895038
Kind Code:
B2
Inventors:
Tomohiro Tamaki
Yoshito Nakazawa
Yoshito Nakazawa
Application Number:
JP2014225792A
Publication Date:
March 30, 2016
Filing Date:
November 06, 2014
Export Citation:
Assignee:
Renesas Electronics Corporation
International Classes:
H01L29/78; H01L21/336; H01L29/06
Domestic Patent References:
| JP2010225831A |
Attorney, Agent or Firm:
Shizuyo Tamamura