Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5896214
Kind Code:
B2
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Inventors:
Tetsuhei Kunimune
Masashi Kuramoto
Satoru Ogawa
Masashi Kuramoto
Satoru Ogawa
Application Number:
JP2012011144A
Publication Date:
March 30, 2016
Filing Date:
January 23, 2012
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/48
Domestic Patent References:
| JP2010212638A | ||||
| JP2010123780A | ||||
| JP2006100500A |
Foreign References:
| WO2010084746A1 | ||||
| WO2010113545A1 | ||||
| WO2010150824A1 |
Attorney, Agent or Firm:
Ikeuchi, Sato & Partners