Title:
保護素子用ヒューズ素子およびそれを利用した回路保護素子
Document Type and Number:
Japanese Patent JP5896412
Kind Code:
B2
Abstract:
A fuse element (10) for a protection device has a base member (11) and a covering member (12) coating at least part of a surface of the base member (11), and is heated to a predetermined heating temperature to be bonded to the protection device. The base member (11) is made of a first fusible metal having a melting point higher than the heating temperature. The covering member (12) is made of a second fusible metal having a melting point lower than the heating temperature.
Inventors:
Shintaro Nakajima
Toru Fujita
Noriyuki Maeda
Toru Fujita
Noriyuki Maeda
Application Number:
JP2012113369A
Publication Date:
March 30, 2016
Filing Date:
May 17, 2012
Export Citation:
Assignee:
NEC Shot Components Co., Ltd.
International Classes:
H01H85/48; H01H37/76; H01H69/02; H01H85/02
Domestic Patent References:
| JP2144821A | ||||
| JP2009170698A |