Title:
部品内蔵基板および実装構造体
Document Type and Number:
Japanese Patent JP5897956
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a component built-in substrate which meets a demand for improving electric reliability.SOLUTION: A component built-in substrate 3 of this invention includes: a first substrate 8 where a through hole T is formed in a thickness direction (Z direction); a metal plate 7 disposed on one main surface of the first substrate 8 so as to cover one opening of the through hole T; a second substrate 9 disposed on the other main surface of the first substrate 8 so as to cover the other opening of the through hole T; and an electronic component 6 housed in the through hole T and disposed on the main surface of the metal plate 7. The first substrate 8 includes a first inorganic insulation layer 11 and a first resin layer 10 laminated on the first inorganic insulation layer 11. A thermal expansion coefficient of the metal plate 7 is larger than a thermal expansion coefficient of the first inorganic insulation layer 11 and is smaller than a thermal expansion coefficient of the first resin layer 10. This structure allows heat of the electronic component 6 to be emitted by the metal plate 7 and thus inhibits failures from occurring in the electronic component 6.
Inventors:
Kei Hayashi
Application Number:
JP2012076761A
Publication Date:
April 06, 2016
Filing Date:
March 29, 2012
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H05K3/46; H01L23/12
Domestic Patent References:
| JP2011003841A | ||||
| JP7087223B2 |
Foreign References:
| WO2011125354A1 |