Title:
素子収納用パッケージおよび実装構造体
Document Type and Number:
Japanese Patent JP5902825
Kind Code:
B2
Abstract:
An element housing package includes a substrate, a frame body, and an input-output terminal. The input-output terminal has a wiring conductor formed in a stacked body consisting of dielectric layers and ground layers which are alternately laminated, to extend through an inside of the stacked body, and a lead terminal connected to the wiring conductor. A non-formation region is provided in the ground layers around the wiring conductor, which passes through the inside of the input-output terminal in a vertical direction of the stacked body. The non-formation region has, in order from an upper side toward a lower side, a first non-formation section, a second non-formation section having an area smaller than that of the first non-formation section, and a third non-formation section having an area larger than that of the second non-formation section.
Inventors:
Yoshinori Kawagashira
Application Number:
JP2014544383A
Publication Date:
April 13, 2016
Filing Date:
September 26, 2013
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/04; H01L23/02
Domestic Patent References:
| JP2004153165A | 2004-05-27 | |||
| JP2005072503A | 2005-03-17 | |||
| JPH05160605A | 1993-06-25 | |||
| JPH0621253A | 1994-01-28 |