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Title:
活性エネルギー線硬化型樹脂組成物及びコーティング剤
Document Type and Number:
Japanese Patent JP5921059
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an active energy ray-curable resin composition that is excellent in adhesiveness to a metal substrate such as aluminum, and prevents peeling of a coating film or changes in the appearance of a coating film even when a coated metal substrate is folded or boiled.SOLUTION: The active energy ray-curable resin composition comprises: a urethane (meth)acrylate compound (A) obtained by allowing a hydroxyl group-containing (meth)acrylate compound (a1), a polyvalent isocyanate compound (a2) and a polyol compound (a3) to react; a urethane (meth)acrylate compound (B) obtained by allowing a hydroxy group-containing (meth)acrylate compound (b1) and a polyvalent isocyanate compound (b2) to react; an acrylic resin (C); and a phosphate group-containing ethylenically unsaturated compound (D). A content ratio (weight ratio of (A):(B)) of the urethane (meth)acrylate compound (A) to the urethane (meth)acrylate compound (B) ranges from 1:0.1 to 1:2.

Inventors:
Hiromitsu Kawamoto
Teruhiko Ogawa
Application Number:
JP2010137902A
Publication Date:
May 24, 2016
Filing Date:
June 17, 2010
Export Citation:
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Assignee:
Nippon Synthetic Chemical Industry Co., Ltd.
International Classes:
C08F299/06; C09D4/00; C09D5/00; C09D5/08; C09D133/00; C09D155/00
Domestic Patent References:
JP200652258A
JP200716145A
JP2006169412A
JP2001114845A
JP2006169308A