Title:
積層型半導体装置、プリント回路板及び積層型半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5921297
Kind Code:
B2
Abstract:
Provided is a multilayered semiconductor device, including: a first semiconductor package including a first semiconductor element and a first wiring board; a second semiconductor package including: a second semiconductor element, a second wiring board and a first encapsulating resin for encapsulating the second semiconductor element therein; and a plate member disposed between the first semiconductor package and the second semiconductor package, the first semiconductor package, the plate member, and the second semiconductor package being stacked in this order, in which the first wiring board and the second wiring board are electrically connected to each other via a metal wire through one of a notch and an opening formed in the plate member and the first semiconductor element, the second semiconductor package, and the metal wire are encapsulated in a second encapsulating resin.
Inventors:
Okada Ariya
Application Number:
JP2012088555A
Publication Date:
May 24, 2016
Filing Date:
April 09, 2012
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L25/10; H01L25/11; H01L25/18
Domestic Patent References:
| JP2006502596A | ||||
| JP2008166803A | ||||
| JP2007281201A |
Attorney, Agent or Firm:
Kazuo Chikajima
Takashi Daejeon
Takashi Daejeon