Title:
ＬＥＤ用リードフレームまたは基板およびその製造方法、ならびに半導体装置およびその製造方法
Document Type and Number:
Japanese Patent JP5922326
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lead frame or substrate for an LED and a manufacturing method thereof and a semiconductor and a manufacturing method thereof to allow light from an LED element to be effectively reflected as well as gas corrosion to be suppressed and good characteristics of reflecting the light from the LED element to be maintained.SOLUTION: An LED lead frame or substrate 10 comprises a body 11 having a mounting surface 11a for placing an LED element 21. The mounting surface 11a of the body 11 is provided with a plating layer 12 for reflecting light, functioning as a reflection layer to reflect light from the LED element 21. The plating layer 12 for reflecting light is composed of an alloy of tin and silver. With the plating layer 12 for reflecting light, the light from the LED element 21 is reflected effectively as well as gas corrosion is suppressed, and characteristics of reflecting the light from the LED element 21 can be maintained.
Inventors:
Kazunori Oda
Akira Sakamoto
Akira Sakamoto
Application Number:
JP2010167298A
Publication Date:
May 24, 2016
Filing Date:
July 26, 2010
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L33/62; H01L23/48; H01L33/52; H01L33/60
Domestic Patent References:
| JP2004241766A | ||||
| JP2006173605A | ||||
| JP38459U | ||||
| JP200976948A | ||||
| JP2009224536A | ||||
| JP2006100500A | ||||
| JP2010166044A |
Foreign References:
| WO2010074184A1 | ||||
| KR1020080088827A |
Attorney, Agent or Firm:
Hirohito Katsunuma
Hiroyuki Nagai
Yukihiro Hotta
Takuhisa Murata
Hiroyuki Nagai
Yukihiro Hotta
Takuhisa Murata