Title:
半導体装置製造用マスクシート及びそれを用いた半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5925560
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a mask sheet capable of taping on a L/F (lead frame) at a lower temperature than a thermoplastic mask sheet, hardly causing such thermal deterioration that an adhesive deposit is generated at the separation of the mask sheet even after being exposed to a high temperature, having flatness with few warps, harder and more excellent in W/B (wire bonding) characteristics at a high temperature than conventional mask sheets, causing less leak of a molding resin at sealing than an adhesive mask sheet, and providing lightly peelable properties hardly causing adhesive deposits even after a plasma cleaning process.SOLUTION: A mask sheet for producing a semiconductor device is obtained by laminating a thermosetting type adhesive layer on one surface of a base material layer, and is to be pasted to a metal plate peelably, in which the thermosetting type adhesive layer contains a polyimide resin containing a siloxane skeleton, a polyfunctional epoxy resin, a both-terminal epoxy resin, a curing agent and a fluorine-based additive.
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Inventors:
Atsushi Yamai
Takayuki Horiya
Takahiro Mori
Takakatsu Ichikawa
Hiromi Yamada
Satoru Machii
Takayuki Horiya
Takahiro Mori
Takakatsu Ichikawa
Hiromi Yamada
Satoru Machii
Application Number:
JP2012084238A
Publication Date:
May 25, 2016
Filing Date:
April 02, 2012
Export Citation:
Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
H01L23/50; C09J7/02; C09J11/06; C09J163/00; C09J179/08; H01L21/56
Domestic Patent References:
| JP2005142401A | ||||
| JP2007123710A |