Title:
電子部品検査装置及び方法
Document Type and Number:
Japanese Patent JP5930021
Kind Code:
B2
Abstract:
An electronic component inspection apparatus includes a light source arranged in a mounting area where at least one electronic component is mounted to a board and a light-receiving sensor arranged outside the mounting area to detect an intensity of a light received from the light source. A computer executes a program to perform a process of determining a state of joining parts in the mounting area based on a result of comparison of the intensity of the light received by the light-receiving sensor with an intensity of distribution previously acquired.
Inventors:
Yu Kurosawa
Masayuki Ito
Izumi Mori
Masayuki Ito
Izumi Mori
Application Number:
JP2014503385A
Publication Date:
June 08, 2016
Filing Date:
March 08, 2012
Export Citation:
Assignee:
富士通株式会社
International Classes:
G01N21/956; G01N21/84; G01N21/88; H01L21/60; H05K3/00; H05K3/34
Domestic Patent References:
| JP2009170699A | ||||
| JP3199947A | ||||
| JP10122828A | ||||
| JP3215704A | ||||
| JP2010123182A | ||||
| JP11190703A | ||||
| JP2011122820A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Takao Kato
Tadahiko Ito
Takao Kato