Title:
ＣＭＰを使用して平坦でない薄膜を形成する方法
Document Type and Number:
Japanese Patent JP5932021
Kind Code:
B2
Abstract:
A method of shaping a substrate in one embodiment includes providing a first support layer, providing a first shaping pattern on the first support layer, providing a substrate on the first shaping pattern, performing a first chemical mechanical polishing (CMP) process on the substrate positioned on the first shaping pattern, and removing the once polished substrate from the first shaping pattern.
Inventors:
Graham, Andrew Bee
Yama, gary
O'Brien, Gary
Yama, gary
O'Brien, Gary
Application Number:
JP2014505326A
Publication Date:
June 08, 2016
Filing Date:
April 13, 2012
Export Citation:
Assignee:
ROBERT BOSCH GMBH
International Classes:
B24B37/00; B81C99/00; H01L21/304
Domestic Patent References:
| JP2000271855A | ||||
| JP62083335A |
Foreign References:
| US20030136759 |
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Yukio Kanegae
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Yukio Kanegae