Title:
Thermal storage heat exchange apparatus
Document Type and Number:
Japanese Patent JP5933731
Kind Code:
B2
Abstract:
A heat storage heat exchange device is provided where it is possible to reduce thermal stress which is imparted to a connection portion of a casing and refrigerant piping which is connected to a heat storage heat exchanger while maintaining sealing of heat storing material in the casing. The heat storage heat exchange device is provided with a heat storage vessel (50), a heat storage heat exchanger (42), a heat storing material (P), gas refrigerant connection piping (45), and a rubber member (55). The gas refrigerant connection piping (45) is connected with the heat storage heat exchanger (42) and extends from an inner section to an outer section by passing through a piping attachment opening (50x) in the heat storage vessel (50). The rubber member (55) seals between the piping attachment opening (50x) in the heat storage vessel (50) and the gas refrigerant connection piping (45). The gas refrigerant connection piping (45) is not fixed with regard to the rubber member (55) and is provided so that movement in a direction of passing through the pipe attachment opening (50x) in the heat storage vessel (50) is free.
Inventors:
Masahiro Honda
Kouhei Kiba
Kouhei Kiba
Application Number:
JP2014538036A
Publication Date:
June 15, 2016
Filing Date:
September 28, 2012
Export Citation:
Assignee:
Daikin Industries, Ltd.
International Classes:
F28F9/00; F16J15/10; F16L5/02; F24F1/30; F28D7/16; F28D20/02
Domestic Patent References:
| JP2001280549A | 2001-10-10 | |||
| JP2005321118A | 2005-11-17 | |||
| JPS57129991A | 1982-08-12 | |||
| JP2001280549A | 2001-10-10 |
Foreign References:
| US3410338A | 1968-11-12 | |||
| US3410338A | 1968-11-12 |
Attorney, Agent or Firm:
Shinki Global IP Patent Corporation
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