Title:
コネクタ
Document Type and Number:
Japanese Patent JP5959212
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a connector which reduces the height when the connector is mounted on a circuit board and secures a creepage distance between a conductive contact of the connector and a conductive cross section of a cutout part of the circuit board.SOLUTION: A circuit board 9 is mainly formed by a conductor member, and insulating treatment is performed on a mounting surface 91. The circuit board 9 has a cutout part 93 cut out in a thickness direction D12 of the circuit board 9, and the insulating treatment is not performed on a cross section 94 formed in the thickness direction D12 of the circuit board 94 and forming the cutout part 93. A connector 1 is placed and mounted on the cutout part 93 on the circuit board 9. The connector 1 includes: a contact 2 formed by a conductor member and electrically connected with an electrode 92 of the mounting surface 91; and a housing 3 formed mainly by an insulation member and holding the contact 2. The housing 3 includes: a cross section covering part 35 covering the cross section 94 of the cutout part 93; and an intervention part 36 provided so as to continue into the cross section covering part 35 and be intervened between the mounting surface 91 and the contact 2.
Inventors:
Satoru Watanabe
Miyazono Katsunori
Miyazono Katsunori
Application Number:
JP2012014929A
Publication Date:
August 02, 2016
Filing Date:
January 27, 2012
Export Citation:
Assignee:
Nippon Crimp Terminal Manufacturing Co., Ltd.
International Classes:
H01R12/71; H01R13/46
Domestic Patent References:
| JP201330291A | ||||
| JP2003249291A | ||||
| JP2006228446A |
Attorney, Agent or Firm:
Masayuki Masabayashi
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