Title:
湿気硬化性オルガノポリシロキサン組成物
Document Type and Number:
Japanese Patent JP6267128
Kind Code:
B2
Abstract:
The present invention provides curable compositions comprising non-Sn organo-metal catalysts that accelerate the condensation curing of moisture curable silicones/non-silicones. In particular, the present invention provides La(III) complexes that are particularly suitable as replacements for organotin for sealant and RTV formulations. The La(III) complexes are comparable to organotin such as DBTDL and exhibit certain behavior in the presence of components that allow for tuning or adjusting the cure characteristics of the present compositions and provide good adhesion and storage stability.
Inventors:
Dinker Sumi
Danabalan Anan Salaman
Danabalan Anan Salaman
Application Number:
JP2014547309A
Publication Date:
January 24, 2018
Filing Date:
December 07, 2012
Export Citation:
Assignee:
Momentive Performance Materials, Inc.
International Classes:
C08L101/10; C08K5/51; C08K5/541; C08K5/56; C09D7/40; C09D201/10; C09J11/04; C09J11/06; C09J201/10
Domestic Patent References:
| JP6033002A | ||||
| JP2008163311A | ||||
| JP1051457A | ||||
| JP2006052353A | ||||
| JP2013508493A |
Foreign References:
| WO2011051173A1 |
Attorney, Agent or Firm:
Junya Tanaka
Mizuya Kamiya
Kyoko Sakoda
Mizuya Kamiya
Kyoko Sakoda