Title:
軟質かつコンディショニング可能な化学機械ウィンドウ研磨パッド
Document Type and Number:
Japanese Patent JP6290004
Kind Code:
B2
Abstract:
A chemical mechanical polishing pad is provided containing: a polishing layer; a plug in place endpoint detection window block; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer comprises the reaction product of ingredients, including: a polyfunctional isocyanate; and, a curative package; wherein the curative package contains an amine initiated polyol curative and a high molecular weight polyol curative; wherein the polishing layer exhibits a density of greater than 0.6 g/cm3; a Shore D hardness of 5 to 40; an elongation to break of 100 to 450%; and, a cut rate of 25 to 150 μm/hr; and, wherein the polishing layer has a polishing surface adapted for polishing the substrate. Also provide are methods of making and using the chemical mechanical polishing pad.
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Inventors:
Baignan Chan
Michelle Kay Jensen
Marty W digroot
Angus Lepper
James Mulnan
Jeffrey James Hendron
John Gee Noland
David B. James
Fenji Ye
Michelle Kay Jensen
Marty W digroot
Angus Lepper
James Mulnan
Jeffrey James Hendron
John Gee Noland
David B. James
Fenji Ye
Application Number:
JP2014112281A
Publication Date:
March 07, 2018
Filing Date:
May 30, 2014
Export Citation:
Assignee:
Rohm and Haas Electronic Materials CMP Housings, Inc.
Dow Global Technologies LLC
Dow Global Technologies LLC
International Classes:
B24B37/24; B24B37/22; H01L21/304
Domestic Patent References:
| JP2007260827A | ||||
| JP2008168416A | ||||
| JP201366993A | ||||
| JP6177665B2 |
Attorney, Agent or Firm:
Patent business corporation Tsukuni
Hajime Tsukuni
Toshio Miyake
Akio Shibata
Yasuhiro Oguni
Yoko Tanaka
Yoshinori Ikukawa
Hajime Tsukuni
Toshio Miyake
Akio Shibata
Yasuhiro Oguni
Yoko Tanaka
Yoshinori Ikukawa