金属基材上にプラチナ系金属基層をめっきするための電解質の浴を製造する方法

Title:

金属基材上にプラチナ系金属基層をめっきするための電解質の浴を製造する方法

Document Type and Number:

Japanese Patent JP6290179

Kind Code:

B2

Abstract:

The invention relates to a method of fabricating a bath of electrolyte for plating a platinum-based metal underlayer on a metallic substrate, the method comprising the following steps: a) providing a first system having ligands and amine functional groups, said first system being constituted by an aqueous solution of an amino ligand comprising at least one compound X—(NH2)n, where X belongs to the group constituted by (CH3, CH3—CH2, CH3—(CH2)m), or NH3 or an xp−(NH4)+p salt where x is an acid radical belonging to the group constituted by (PO43−, HPO42−, H2PO4−, HPO42−and H2PO4−, SO42−, HSO4−, H2SO4, HSO4−, and H2SO4, CH3COO−, CH3COOH, and CH3COO−), or H2SO4, or CH3COOH, and where n, m, and p are non-zero integers; b) providing a second system forming a buffer system; c) providing a third system providing a metallic salt, and constituted by an aqueous solution of platinum; d) providing a fourth system suitable for imparting the conduction property to the medium; and e) mixing together the four systems so as to obtain the said electrolyte bath. The method is applicable to plating a metallic underlayer as a thermal barrier on a part made of superalloy.

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JPH0770330

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Inventors:

Hugo, Juliet
Lagrange, Frederick
More, Elbe

Application Number:

JP2015506292A

Publication Date:

March 07, 2018

Filing Date:

April 18, 2013

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