Title:
半導体装置
Document Type and Number:
Japanese Patent JP6300386
Kind Code:
B2
Abstract:
Provided is a semiconductor device with high reliability. In order to solve the above problems, according to the present invention, the semiconductor device includes a heat dissipating substrate, an insulating substrate arranged on the heat dissipating substrate and having a wiring layer, a plurality of semiconductor elements arranged on the insulating substrate, a conductive block electrically connected to a front surface electrode of the semiconductor element, and a terminal electrode, in which the conductive block has a convex portion, and the convex portion is bonded to the insulating substrate.
Inventors:
Tetsutoyo Konno
Application Number:
JP2017507557A
Publication Date:
March 28, 2018
Filing Date:
February 03, 2016
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L21/60; H01L23/40; H01L25/07; H01L25/18
Domestic Patent References:
| JP2005064441A | ||||
| JP2010129550A | ||||
| JP2015015270A | ||||
| JP2014022579A | ||||
| JP2010232369A |
Foreign References:
| WO2012014843A1 | ||||
| US20130176682 |
Attorney, Agent or Firm:
Isono International Patent and Trademark Office
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