Title:
脆性基板の分断方法
Document Type and Number:
Japanese Patent JP6311798
Kind Code:
B2
Inventors:
Hiroshi Soyama
Application Number:
JP2016561495A
Publication Date:
April 18, 2018
Filing Date:
November 12, 2015
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B28D5/00; C03B33/023
Domestic Patent References:
| JP200579526A | ||||
| JP7240571A | ||||
| JP2012792A |
Foreign References:
| US20110183116 |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita