Title:
磁気遮蔽集積回路パッケージ
Document Type and Number:
Japanese Patent JP6372898
Kind Code:
B2
Abstract:
Embodiments of the present disclosure are directed towards magnetic shielded integrated circuit (IC) package assemblies and materials for shielding integrated circuits from external magnetic fields. In one embodiment, a package assembly includes a die coupled with a package substrate and a mold compound disposed on the die. The mold compound includes a matrix component and magnetic field absorbing particles. Other embodiments may be described and/or claimed.
Inventors:
Thunkman, Robert El.
Nikonov, Dimitri E.
Bread, gin
Nikonov, Dimitri E.
Bread, gin
Application Number:
JP2016540865A
Publication Date:
August 15, 2018
Filing Date:
October 15, 2013
Export Citation:
Assignee:
INTEL CORPORATION
International Classes:
H01L23/29; H01L21/8239; H01L23/31; H01L25/065; H01L25/07; H01L25/18; H01L27/105; H01L29/82; H01L43/02; H05K9/00
Domestic Patent References:
| JP2009170802A | ||||
| JP2000077831A | ||||
| JP10150290A | ||||
| JP6072243U | ||||
| JP61073341A | ||||
| JP2004240978A |
Foreign References:
| US20040150091 | ||||
| WO2001073843A1 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation