半導体装置 - ROHM Co., Ltd.

Title:

半導体装置

Document Type and Number:

Japanese Patent JP6373642

Kind Code:

B2

Abstract:

A semiconductor device is provided with a substrate including a main surface and a back surface that face in opposite directions to each other in a thickness direction, and first, second and third direction sensor elements having different detection reference axes from each other. The substrate is formed with a recessed portion that is recessed from the main surface toward the back surface side. The first direction sensor element is disposed at least partially within the recessed portion. The second direction sensor element is disposed so as to overlap with the main surface as viewed in the thickness direction.

Inventors:

Taro Nishioka
Mamoru Yamagami

Application Number:

JP2014110172A

Publication Date:

August 15, 2018

Filing Date:

May 28, 2014

Export Citation:

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