Title:
電子装置
Document Type and Number:
Japanese Patent JP6378506
Kind Code:
B2
Abstract:
An electronic device and a method for manufacturing an outer housing of the electronic device are provided. The electronic device includes an outer housing including a portion including a base including a non-conductive material and a plurality of islands formed on or above the base, wherein the plurality of islands include metallic materials, wherein the plurality of islands are spaced apart from each other, and wherein the plurality of islands form a two-dimensional (2D) pattern. The method includes injection-molding a base and forming a plurality of islands on or above the base, wherein the plurality of islands include metallic materials, and wherein the plurality of islands are spaced apart from each other to form a 2D pattern.
Inventors:
Twilight
Gold pillar
Bun-hee Satoshi
Cui Chong Sat
Gold pillar
Bun-hee Satoshi
Cui Chong Sat
Application Number:
JP2014049036A
Publication Date:
August 22, 2018
Filing Date:
March 12, 2014
Export Citation:
Assignee:
Samsung Electronics Co.,Ltd.
International Classes:
H05K5/02; H01Q1/24; H04M1/02
Domestic Patent References:
| JP2002189085A | ||||
| JP2007282102A | ||||
| JP2012239151A | ||||
| JP2013021431A | ||||
| JP2006203520A | ||||
| JP2003289355A |
Foreign References:
| US20120329531 | ||||
| WO2011099447A1 |
Attorney, Agent or Firm:
Kyosei International Patent Office