杭頭接合構造 - Senxia Co., Ltd.

Title:

杭頭接合構造

Document Type and Number:

Japanese Patent JP6381070

Kind Code:

B2

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Inventors:

Hidenobu Tanaka
Kosuke Fukuchi
Taku Tomita
Yusuke Homma
Bando Shinpei
Ishikawa Kazuma

Application Number:

JP2014123755A

Publication Date:

August 29, 2018

Filing Date:

June 16, 2014

Export Citation:

Assignee:

Senxia Co., Ltd.
Japan Pile Co., Ltd.

International Classes:

E02D27/12

Domestic Patent References:

Attorney, Agent or Firm:

Yoshiaki Yamaki

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