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Title:
テーピング装置
Document Type and Number:
Japanese Patent JP6381164
Kind Code:
B2
Abstract:
A taping apparatus includes a pressing member for pressing one of a carrier tape and a cover tape against the other at a bonding position so as to perform bonding, a transfer mechanism that transfers the carrier tape in a state where the carrier tape is provided with a tension region along a range from an upstream side of a joining position to a downstream side of the bonding position, an upper guide disposed above the tension region, and a push-up mechanism configured to press the tension region entirely or partially against the upper guide from below.

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JPH0728157[Title of Invention] Electronic component mounting device
Inventors:
Shinpei Higashi
Application Number:
JP2017132690A
Publication Date:
August 29, 2018
Filing Date:
July 06, 2017
Export Citation:
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Assignee:
Ueno Seiki Co., Ltd.
International Classes:
B65B15/04; B65D85/86
Domestic Patent References:
JP2003221008A
JP2009277907A
JP2001196788A
Foreign References:
WO1998037746A1
Attorney, Agent or Firm:
Fujio Nakamae
Yohei Kiyoi
Yoshihiro Kurita



 
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