Title:
パワーモジュール
Document Type and Number:
Japanese Patent JP6381784
Kind Code:
B2
Abstract:
A power module will be provided which can suppress insulation performance deterioration caused by heat cycle to ensure insulation performance, by suppressing generation of bubbles and occurrence of detachments between silicone gel and an insulating substrate at a high or low temperature or at a high working voltage. The power module includes: an insulating substrate 2 on a first face of which a semiconductor element 3 is provided; a base plate 1 joined to a second face of the insulating substrate 2; a case member 6 surrounding the insulating substrate 2 and being in contact with a face of the base plate 1, that is joined to the insulating place 2; sealing resin 8 filling a region surrounded by the base plate 1 and the case member 6 to seal the insulating substrate 2; a pressing plate 9 disposed in close contact with a surface of the sealing resin 8 in a side of the first face of the insulating substrate 2; and a lid member 7 facing an opposite face of the pressing plate 9 with respect to a face thereof in close contact with the sealing resin 8, and being fixed to the case member 6 at a position to prevent the pressing plate 9 from ascending.
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Inventors:
Masaki Taya
Application Number:
JP2017509373A
Publication Date:
August 29, 2018
Filing Date:
February 19, 2016
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H01L25/07; H01L23/24; H01L23/29; H01L23/31; H01L25/18
Domestic Patent References:
| JP2000311970A | ||||
| JP2013149819A | ||||
| JP1108951U | ||||
| JP5121881A | ||||
| JP2003152136A |
Foreign References:
| WO2002059969A1 |
Attorney, Agent or Firm:
Fukami patent office
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