Title:
半導体装置の製造方法、半導体装置及び半導体装置製造用部材
Document Type and Number:
Japanese Patent JP6384118
Kind Code:
B2
Inventors:
Kazuhiko Kurabuchi
Makino Tatsuya
Takayuki Matsuzaki
Daisuke Fujimoto
Makino Tatsuya
Takayuki Matsuzaki
Daisuke Fujimoto
Application Number:
JP2014099314A
Publication Date:
September 05, 2018
Filing Date:
May 13, 2014
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L23/12; H01L23/28
Domestic Patent References:
| JP11121646A | ||||
| JP2014082276A | ||||
| JP2013225610A | ||||
| JP2010087499A | ||||
| JP2004063615A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Tomoya Furoshita
Osaka Koichi
Yoshinori Shimizu
Tomoya Furoshita
Osaka Koichi