Title:
研磨剤及び研磨方法
Document Type and Number:
Japanese Patent JP6387944
Kind Code:
B2
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Inventors:
Michito Sato
Application Number:
JP2015222414A
Publication Date:
September 12, 2018
Filing Date:
November 12, 2015
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L21/304; B24B37/00; C09K3/14
Domestic Patent References:
| JP2005088394A | ||||
| JP2001003036A | ||||
| JP11126771A | ||||
| JP2109332A | ||||
| JP3068137A |
Foreign References:
| WO2011142362A1 |
Attorney, Agent or Firm:
Mikio Yoshimiya